3D Packaging has become a key enabling technology in mainstream products such as Core Processors, FPGA’s, Communications devices. This Network event provides an opportunity to learn about the latest developments in this exciting technology from Chip through Package to end application. Case study examples from Industry experts will share in depth knowledge on the benefits such as low cost / higher performance and challenges such as Test access and materials limitations. The event will include an exhibition of leading companies engaged in the supply chain of IC Package technologies.
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